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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations because there is no space for detailed speci?cations. Therefore, please review our product speci?cations or consult the approval sheet for product speci?cations before ordering.
P05E.pdf
Nov.24,2011
MHz SMD Type CERAFIL r Notice
c SFSCE10M7WF03-R0 Notice
o Soldering and Mounting
1. Standard Reflow Soldering Conditions
(1) Reflow
Filter is soldered twice within the following temperature
conditions.
240
Peak
(240°C max.)
230
Heating
(230°C)
100
Pre-heating
(150-180°C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
30 sec.
max.
120 sec.
min.
(2) Soldering Iron
Filter is soldered at +280±5°C for 3.0±0.5 seconds. The
soldering iron should not touch the filter while soldering.
(3) Condition for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component might be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
(4) Other
(a) The component may be damaged if excess
mechanical stress is applied to it mounted on the
printed circuit board.
[Component Layout Close to Board]
(b) Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of
the board.
Perforation
A
B
Slit
C
Susceptibility to
stress is in the order
of : A>C>B
(c) After installing components, if solder is excessively
applied to the circuit board, mechanical stress will
cause destruction resistance characteristics to
degrade. To prevent this, be extremely careful in
determining shape and dimension before designing
the circuit board diagram.
[Component Direction]
Place the compon-
ent laterally to the
direction in which
stress acts.
(d) When the positioning claws and pick-up nozzle are
worn, the load is applied to the components while
positioning is concentrated on positioning accuracy,
etc. Careful checking and maintenance are necessary
to prevent unexpected trouble.
(e) When correcting components with a soldering iron,
the tip of the soldering iron should not directly touch
the component.
(f) Do not use strong acidity flux, more than 0.2wt%
chlorine content, in reflow soldering.
Continued on the following page.
27
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